Service support
Service support
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R&D Team
  • R & D personnel account for over 28% of the total(Most of R&D engineers with more than 10 years’ experience)
  • A full-spectrum team with experience in optical, electronic, mechanical, software, testing, and manufacturing procedures
Innovative COB/BOX packaging technologies

COB: Mature COB (chip on board) technology is applied to the QSFP28 optical module to achieve superior optical performance indexes while ensuring high reliability.

Products:100G QSFP28 SR4/100G QSFP28 LR4/100G QSFP28 AOC/25G SFP28 SR/25G SFP28 AOC.etc

R&D and Design
Material Clean
R&D and Design
LD-Die Bond
R&D and Design
LIV Test
R&D and Design
Auto Bond
R&D and Design
Wire Bond
R&D and Design
Alignment


BOX:High Speed Hermetic BOX Packaging for High precision machiningand Stable Gold Wire Bonding for AWG/TFF BOX Packaging

Products:100G QSFP28 LR4/100G QSFP28 ER4/25G SFP28 LR/25G SFP28 CWDM/25G SFP28 DWDM/25G SFP28 Lan WDM .etc

R&D and Design
Material Clean
R&D and Design
LD-Die Bond
R&D and Design
LIV Test
R&D and Design
Auto Bond
R&D and Design
Alignment
Leading National key R&D plan
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